ICP-RIE Plasma Etching:

Plasma_cryogenicSiPlasma_lithographyPlasma etching result of VCSEL structure using Ar-Cl2 gas mixtureEtching process result of Si-DRIE (SF6-C4F8-O2) post O2 cleanPlasma etching result of SF6-C4F8 based gas chopping process(IAP-Jena)ICP PECVD TEOS SiO2 film step coverage over Si ridge(IISB-Erlangen)ICP RIE result of SF6O2-C4F8-based Si gas chopping process

What's New?

Thin Film Measurement of MEMS and Sensors

SENTECH proudly presents the SENDURO®MEMS for fully automatic metrology quality control in sensor and MEMS production. The SENDURO®MEMS provides reliable and precise measurement of thin film stacks, using spectroscopic reflectometry and ellipsometry. The SENDURO®MEMS equipped with reflectometer is for fast thin film measurement. →read more


SENTECH offers an application oriented seminar “Plasma-Process-Technology” on April 7, 2022 at SENTECH in Berlin-Adlershof. Applications for low damage etching and deposition will be presented in sensors, quantum and III-V-devices. →read more

Upcoming Events:

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Fax: +49 (0)89 - 89 79 60 722
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